Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014 mainly deals with the followings: Overview of semiconductor industry Status quo of memory and wafer foundry industry Downstream market of semiconductor industry Trend in emerging advanced packaging technology Packaging equipment industry analysis and ranking 15 major advanced packaging equipment vendors Packaging equipment can fall into two categories: wafer level and die level. And the former is typically included in wafer equipment as it is used in the manufacturing of wafer.
http://www.marketresearchreports.biz/analysis/218415
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